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Филтриране по категории

Thermal adhesive double tape AM-TAFD-4- 211x 298mm

Thermal adhesive double tape AM-TAFD-4- 211x 298mm

Dimentions: 211x 298mm


Bonding heat sink for PCB and IC package, Mounting of IC, GPU, heat pipe and heat sink during assembly

13.83 лв.excl. VAT

16.60 лв.incl. VAT

Thermal adhesive double tape 211x 298mm
Dimentions 211x 298mm
Material thermal acryic double-sided tape
Heat Dissipation 1W/mK
More informationтермопроводима лепенка
  • Weight:
    0.01 kg
  • Тип вграждане:

    211 x 298mm

  • Тип вграждане:

    акрилна основа

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