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Филтриране по категории

THERMAL PAD AMG-100- 225x225mm, 26 W/m.K

SKU: 42-5-en Category:

Thermal pad- AMG-100- 225x225mm, 26 W/m.K

Dimentions: 225 x 225 mm


Bonding heat sink for PCB and IC package, Mounting of IC, GPU, heat pipe and heat sink during assembly

25.00 лв.excl. VAT

30.00 лв.incl. VAT

Features Thermal pad  AMG-100- 225x225mm, 26 W/m.K
Color silver gray
Thickness 0.100mm
Density g/cm3 0.85
Thermal conductivity (in plane)X/Y Typ(W/m.K) 700
Thermal conductivity (through thickness) Z Typ ( W/m.K) 26
Thermal diffusivity cm2/s 8 ~ 10
Tensil Strenght  MPa 20
Electrical conductivity S/cm 20000
CTE (coefficient of thermal expansion)  1/K 9.3 х10 ⁻⁷
Operating temperature ° C -40~+400
Specific heat @50° C J/kg –° C 850
Rohs compliant yes
AMG-100 Graphite Heat Spreader is high crystallized graphite made from carbon materials in sheet style by a special process. It is ideal for providing thermal management solutions in limited spaces.
EMI shielding and absorbing to protect sensitive electronic parts
  • Weight:
    0.100 kg
  • Тип вграждане:

    225 x 225mm

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