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Филтриране по категории

THERMAL PAD AMG-100- 225x225mm, 26 W/m.K

SKU: 42-5-en Category:

Thermal pad- AMG-100- 225x225mm, 26 W/m.K

Dimentions: 225 x 225 mm


Bonding heat sink for PCB and IC package, Mounting of IC, GPU, heat pipe and heat sink during assembly

25.00 лв. excl. VAT ( 30.00 лв. incl. VAT )

Features Thermal pad  AMG-100- 225x225mm, 26 W/m.K
Color silver gray
Thickness 0.100mm
Density g/cm3 0.85
Thermal conductivity (in plane)X/Y Typ(W/m.K) 700
Thermal conductivity (through thickness) Z Typ ( W/m.K) 26
Thermal diffusivity cm2/s 8 ~ 10
Tensil Strenght  MPa 20
Electrical conductivity S/cm 20000
CTE (coefficient of thermal expansion)  1/K 9.3 х10 ⁻⁷
Operating temperature ° C -40~+400
Specific heat @50° C J/kg –° C 850
Rohs compliant yes
AMG-100 Graphite Heat Spreader is high crystallized graphite made from carbon materials in sheet style by a special process. It is ideal for providing thermal management solutions in limited spaces.
EMI shielding and absorbing to protect sensitive electronic parts
  • Weight:
    0.1 kg
  • Тип вграждане:

    225 x 225mm

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