Thermally conductive double adhesive tape designed for bonding heatsinks to power LEDs (COB LEDs) for better thermal dissipation
Thermal conductive materials
Sort by
View
Thermal pad AM-TAUM Dimentions: 28 x 28 mm Application: Bonding heat sink for PCB and IC package, Mounting of IC,…
Thermal pad- AMG-100- 225x225mm, 26 W/m.K Dimentions: 225 x 225 mm Application: Bonding heat sink for PCB and IC package,…
Thermal adhesive double tape AM-TAJ210-17 -19x19mm Dimentions: 19 x 19 mm Application: Bonding heat sink for PCB and IC package,…
Thermal adhesive double tape AM-TAJ210-17 -28x28mm Dimentions: 28 x 28 mm Application: Bonding heat sink for PCB and IC package,…
Thermal adhesive double tape 19x19mm Dimentions: 19 x 19 mm Application: Bonding heat sink for PCB and IC package, Mounting…
Thermal adhesive double tape AM-TAFD-3 Dimentions: 28 x 28 mm Application: Bonding heat sink for PCB and IC package, Mounting…
Thermal adhesive double tape AM-TAFD-4- 211x 298mm Dimentions: 211x 298mm Application: Bonding heat sink for PCB and IC package, Mounting…
