Thermal adhesive double tape AM-TAFD-4- 211x 298mm

SKU: 42-3-en Category:

Thermal adhesive double tape AM-TAFD-4- 211x 298mm

Dimentions: 211x 298mm


Bonding heat sink for PCB and IC package, Mounting of IC, GPU, heat pipe and heat sink during assembly

13.83 лв. excl. VAT ( 16.60 лв. incl. VAT )

Thermal adhesive double tape 211x 298mm
Dimentions 211x 298mm
Material thermal acryic double-sided tape
Heat Dissipation 1W/mK
More informationтермопроводима лепенка
  • Weight:
    0.01 kg
  • Size:

    211 x 298mm

  • Material:

    акрилна основа

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